LOCTITE® 3517M, 30 ml Barrel/drum
Henkel
LOCTITE® 3517M underfill is designed for use as a solder joint protection against mechanical stress in hand held electronic device applications.
- One component - requires no mixing
- Reworkable
- Low halogen content
Availability: on demand
LOCTITE 3517M, Epoxy, Underfill
Safety Data Sheet (SDS) on request