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LOCTITE® 3517M, 30 ml Barrel/drum

Henkel
LOCTITE® 3517M underfill is designed for use as a solder joint protection against mechanical stress in hand held electronic device applications.
  • One component - requires no mixing
  • Reworkable
  • Low halogen content
Availability: on demand
Persönliche Beratung
LOCTITE 3517M, Epoxy, Underfill

Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® 3517M underfill is designed for use as a solder joint protection against mechanical stress in hand held electronic device applications.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Barrel
Physical appereance Liquid
More Information
BMC internal key 1658529
Colour Black
Regional availability on demand
Brands LOCTITE®