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LOCTITE® ABLESTIK 550K

Henkel
LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding
  • Low cure temperature
  • High thermal conductivity
  • Suitable for an array of difficult-to-bond substrates
Availability: on demand
Persönliche Beratung
LOCTITE ABLESTIK 550K, Epoxy Film, Assembly
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding
Chemical Base Epoxy
Curing Type Heat cure
Packaging type Other types of packaging
More Information
BMC internal key 1202169
Colour White
Regional availability on demand
Brands LOCTITE®