LOCTITE® ECCOBOND 3707, 30 ml Syringe
Henkel
LOCTITE® ECCOBOND EN 3707 no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
- Fast UV Cure
- Good adhesion
- Reworkable
- Co-cure with UV curable conformal coating
Availability: on demand
LOCTITE ECCOBOND EN 3707, Edgebond Underfill, Dual cure, fast UV, 1 component, epoxy
Safety Data Sheet (SDS) on request
