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LOCTITE® ECCOBOND E 1172 A, Part A

Henkel
LOCTITE® ECCOBOND E 1172 A is an epoxy based, single component underfill that provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.This product cures fast at low temperatures and exhibits low CTE with long pot life.
  • Void free underfill
  • Single component
  • Long pot life
  • Fast Cure
Availability: on demand
Persönliche Beratung
LOCTITE ECCOBOND E 1172 A is a single component underfill for use with very fine area array devices where SMT transparent processing is critical.
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND E 1172 A is an epoxy based, single component underfill that provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.This product cures fast at low temperatures and exhibits low CTE with long pot life.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Other types of packaging
More Information
BMC internal key 1189514
Colour brown
Regional availability on demand
Brands LOCTITE®