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LOCTITE® ECCOBOND EO7039, 5 ml Syringe

Henkel
LOCTITE® ECCOBOND EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. This material is formulated to produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic substrates and various metal surfaces.
    Availability: on demand
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    LOCTITE® ECCOBOND EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. This material is formulated to produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic substrates and various metal surfaces.
    Packaging type Syringe
    More Information
    BMC internal key 891429
    Regional availability on demand
    Brands LOCTITE®