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LOCTITE® ECCOBOND FP4323, 10 cc Barrel/drum

Henkel
LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
  • Low CTE for improved thermal cycling
  • Thixotropic
  • High purity
  • Excellent moisture resistance
Availability: on demand
Persönliche Beratung
LOCTITE ECCOBOND FP4323, Epoxy, Encapsulant - glob top

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
Chemical Base Epoxy
Curing Type Heat cure
Packaging type Barrel
Physical appereance Liquid
More Information
BMC internal key 467120
Colour Black
Regional availability on demand
Brands LOCTITE®