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LOCTITE® ECCOBOND FP4470, 10 cc Syringe

Henkel
LOCTITE® ECCOBOND FP4470 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC Level 2A (60°C/60% RH, 120 hours) preconditioning. LOCTITE ECCOBOND FP4470 is a high adhesion version of FP4450 for 260°C L3 JEDEC performance.
  • High purity
  • 260°C reflow capability for Pb-free applications
  • Green product
  • Excellent flow properties
Availability: on demand
Persönliche Beratung
LOCTITE ECCOBOND FP4470, Epoxy, Encapsulant
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND FP4470 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC Level 2A (60°C/60% RH, 120 hours) preconditioning. LOCTITE ECCOBOND FP4470 is a high adhesion version of FP4450 for 260°C L3 JEDEC performance.
Chemical Base Epoxy
Curing Type Heat cure
Packaging type Syringe
More Information
BMC internal key 556652
Colour Black
Regional availability on demand
Brands LOCTITE®