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LOCTITE® ECCOBOND UF 3800, 30 ml Syringe

Henkel
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
  • Reworkable
  • High Tg
  • Room temperature flow capability
  • Fast cure at moderate temperatures
Availability: on demand
Persönliche Beratung
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Syringe
Physical appereance Liquid
More Information
BMC internal key 1178634
Colour Black
Regional availability on demand
Brands LOCTITE®