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LOCTITE® ECCOBOND UF 3808, 50 ml Barrel/drum

Henkel
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
  • High Tg
  • Reworkable
  • Low CTE
  • Room temperature flow capability
Availability: on demand
Persönliche Beratung
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Barrel
Physical appereance Liquid
More Information
BMC internal key 1440696
Colour Black
Regional availability on demand
Brands LOCTITE®