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LOCTITE® ECCOBOND UF 3812, Standard cartridge

Henkel
LOCTITE® ECCOBOND UF 3812 reworkable epoxy underfill is designed for CSP, WLCSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
  • Halogen-free
  • Low viscosity material flows at room temperature with no additional preheating required
  • High Tg and high fracture toughness enable excellent protection of solder joints during thermal cycling
  • Room temperature flow capability
Availability: on demand
Persönliche Beratung
LOCTITE ECCOBOND UF 3812, Halogen-free, Reworkable, Low viscosity, Fast cure, Epoxy, Underfill, Encapsulant
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND UF 3812 reworkable epoxy underfill is designed for CSP, WLCSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Cartridge
Physical appereance Liquid
More Information
BMC internal key 2310026
Colour Black
Regional availability on demand
Brands LOCTITE®