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LOCTITE® 3621, 10 ml Syringe

Henkel
LOCTITE® 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Particularly suited where dispense speeds greater than 35,000 dots/h are required. LOCTITE 3621 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
  • One component - requires no mixing
  • Very high dispense speed
  • High wet strength
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE 3621, Epoxid, Klebstoff für Oberflächenmontage

Technisches Datenblatt (TDS)

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Particularly suited where dispense speeds greater than 35,000 dots/h are required. LOCTITE 3621 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
Chemische Basis Epoxy
Anzahl Komponenten 1-Komponenten System
Härtemechanismus Heißhärtend
Verpackungsart Spritze
Maximale Dauerbetriebstemperatur (°C) 150 °C
Max. Viskosität (mPas) 168
Min. Viskosität (mPas) 500 mPas
Topzeit / Offenzeit 24 h
Erscheinungsbild Gel
Weitere Informationen
BMC interner Schlüsselcode 255257
Farbe Rot
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®
ERP Artikelnummer (BMC) HE255257