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LOCTITE® ABLESTIK 561

Henkel
LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561 adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive is also available in a low temperature cure version.
  • Thermally conductive : 2.0 W/m-K
  • Reworkable
  • Flexible
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE ABLESTIK 561, Epoxidfilm, Montage
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Technisches Datenblatt (TDS)

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561 adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive is also available in a low temperature cure version.
Verpackungsart Andere Verpackungsarten
Weitere Informationen
BMC interner Schlüsselcode 2110878
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®