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LOCTITE® ABLESTIK 8387B

Henkel
LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC. Please refer to the TDS for alternate cure schedules.
  • Black pigmentation for blocking stray light
  • Non-conductive
  • Fast cure
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE ABLESTIK 8387B, Epoxid, Die Attach, Nichtleitender Klebstoff
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Technisches Datenblatt (TDS)

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC. Please refer to the TDS for alternate cure schedules.
Chemische Basis Epoxy
Härtemechanismus Heißhärtend
Verpackungsart Andere Verpackungsarten
Weitere Informationen
BMC interner Schlüsselcode 1201266
Farbe Schwarz
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®