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LOCTITE® ABLESTIK CDF 200

Henkel
LOCTITE® ABLESTIK CDF 200 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm . This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes.
  • High MSL reliability
  • Controlled fillet size
  • Consistent bondline thickness
  • No resin bleed-out
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE ABLESTIK CDF 200, Hybridchemie, Die Attach
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Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® ABLESTIK CDF 200 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm . This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes.
Verpackungsart Andere Verpackungsarten
Weitere Informationen
BMC interner Schlüsselcode 1874590
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®