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LOCTITE® ABLESTIK QMI536NB

Henkel
LOCTITE® ABLESTIK QMI536NB is a low bleed non conductive, PTFE-filled paste designed for stacked die applications which require very low stress and robust mechanical properties. The material has the same processing and properties of QMI536 but resin bleed is essentially eliminated. These features produce fast cure capability and enhanced reliability performance to a wide variety of surfaces, including solder resist, flexible tape, bare silicon and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning after multiple exposures to lead-free solder reflow temperatures.
  • Stacked die application
  • Low bleed
  • High resistance
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE ABLESTIK QMI536NB, Bismaleimidharz, Die Attach, Low Bleed nicht leitend, PTFE-gefüllte Paste

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® ABLESTIK QMI536NB is a low bleed non conductive, PTFE-filled paste designed for stacked die applications which require very low stress and robust mechanical properties. The material has the same processing and properties of QMI536 but resin bleed is essentially eliminated. These features produce fast cure capability and enhanced reliability performance to a wide variety of surfaces, including solder resist, flexible tape, bare silicon and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning after multiple exposures to lead-free solder reflow temperatures.
Verpackungsart Andere Verpackungsarten
Weitere Informationen
BMC interner Schlüsselcode 1432387
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®