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LOCTITE® ECCOBOND DAM 7010C

Henkel
LOCTITE® ECCOBOND DAM 7010C is formulated to be used in combination with a "fill" encapsulant LOCTITE ECCOBOND FIL 7010C as a dam encapsulant. It is specially designed for glob top applications where protection of wire bonded bare IC is required. This two material combination is also suited for the protection of multiple chips and for encapsulating components where a well-defined glob height and flat surface are required.
  • Crack and thermal resistant
  • Good chemical resistance
  • Low thermal expansion
  • High purity
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE ECCOBOND DAM 7010C, Damm-Vergussmasse
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Technisches Datenblatt (TDS)

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® ECCOBOND DAM 7010C is formulated to be used in combination with a "fill" encapsulant LOCTITE ECCOBOND FIL 7010C as a dam encapsulant. It is specially designed for glob top applications where protection of wire bonded bare IC is required. This two material combination is also suited for the protection of multiple chips and for encapsulating components where a well-defined glob height and flat surface are required.
Chemische Basis Epoxy
Anzahl Komponenten 1-Komponenten System
Härtemechanismus Heißhärtend
Verpackungsart Andere Verpackungsarten
Weitere Informationen
BMC interner Schlüsselcode 2648781
Farbe Schwarz
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®