LOCTITE® ECCOBOND E 3200
Henkel
LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
- Fast and low temperature cure
- Resilient
- Sag resistant paste
- Flexible epoxy
Verfügbarkeit: auf Anfrage
LOCTITE ECCOBOND E 3200, Durchbiegungsfest, Flexibel, Montage, Epoxid
Sicherheitsdatenblätter (SDB) auf Anfrage
