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LOCTITE® ECCOBOND EN 3707F, 55 cc Syringe

Henkel
LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
  • Dual cure
  • Fast UV cure
  • Cures in shadowed areas with heat
  • Easy dispensability without stringing
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE ECCOBOND EN 3707F, Epoxid, Vergussmasse

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
Verpackungsart Spritze
Weitere Informationen
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®