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LOCTITE® ECCOBOND FP4323, 35 cc Syringe

Henkel
LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
  • Low CTE for improved thermal cycling
  • Thixotropic
  • High purity
  • Excellent moisture resistance
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE ECCOBOND FP4323, Epoxid, Vergussmasse - glob top

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
Chemische Basis Epoxy
Härtemechanismus Heißhärtend
Verpackungsart Spritze
Erscheinungsbild Flüssig
Weitere Informationen
BMC interner Schlüsselcode 452110
Farbe Schwarz
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®
ERP Artikelnummer (BMC) HE452110

LOCTITE® ECCOBOND FP4323, 35 cc Syringe

Persönliche Beratung