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LOCTITE® ECCOBOND UF 3812, Standard cartridge

Henkel
LOCTITE® ECCOBOND UF 3812 reworkable epoxy underfill is designed for CSP, WLCSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
  • Halogen-free
  • Low viscosity material flows at room temperature with no additional preheating required
  • High Tg and high fracture toughness enable excellent protection of solder joints during thermal cycling
  • Room temperature flow capability
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE ECCOBOND UF 3812, Halogenfrei, Nacharbeitbar, Niedrige Viskosität, Schnelle Aushärtung, Epoxid, Underfill, Vergussmasse
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Technisches Datenblatt (TDS)

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® ECCOBOND UF 3812 reworkable epoxy underfill is designed for CSP, WLCSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
Chemische Basis Epoxy
Anzahl Komponenten 1-Komponenten System
Härtemechanismus Heißhärtend
Verpackungsart Kartusche
Erscheinungsbild Flüssig
Weitere Informationen
BMC interner Schlüsselcode 2310026
Farbe Schwarz
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®