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LOCTITE® ECCOBOND UF 3820, Syringe

Henkel
LOCTITE® ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
  • Halogen free
  • Easy rework
  • High Tg
  • One component
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE ECCOBOND UF 3820, Epoxidharz, Underfill

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
Verpackungsart Spritze
Weitere Informationen
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®