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LOCTITE® 3563, 10 ml Syringe

Henkel
LOCTITE® 3563 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 µm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.
  • One component - requires no mixing
  • Fast flowing epoxy liquid
  • Production - high speed curing
Verfügbarkeit: auf Anfrage
Persönliche Beratung
LOCTITE 3563, Epoxid, einkomponentig
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Technisches Datenblatt (TDS)

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® 3563 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 µm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.
Chemische Basis Epoxy
Anzahl Komponenten 1-Komponenten System
Härtemechanismus Heißhärtend
Verpackungsart Spritze
Erscheinungsbild Flüssig
Weitere Informationen
BMC interner Schlüsselcode 144828
Farbe braun
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®