LOCTITE® ABLESTIK QMI509, Syringe
Henkel
LOCTITE® ABLESTIK QMI509 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. This adhesive also exhibits a very low modulus, which can reduce inter-package stress. A package or device manufactured with LOCTITE ABLESTIK QMI509 will have good resistance to delamination and “popcorning” after exposure to reflow temperatures. LOCTITE ABLESTIK QMI509 can be cured in a conventional oven, on a snap cure oven, or utilize SkipCure™ processing on a die bonder or wire bonder.
- Electrically conductive
- Stable at high temperatures
- Void-free bondline
- Hydrophobic
Verfügbarkeit: auf Anfrage
LOCTITE ABLESTIK QMI509, Bismaleimidharz, Die Attach, silbergefüllter leitfähiger Klebstoff
Sicherheitsdatenblätter (SDB) auf Anfrage
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