LOCTITE® ECCOBOND UF 4550HTC

LOCTITE® ECCOBOND UF 4550HTC is a board level capillary underfill designed to provide enhanced thermal properties and adhesion to integrated circuit passivation material and flex circuits. LOCTITE ECCOBOND UF 4550HTC is designed to quickly underfill at elevated substrate temperature of 90 to 110 °C. LOCTITE ECCOBOND UF 4550HTC provides thermal conductivity for applications where thermal management is required. This material is also engineered to provide good thermal cycle reliability for PCBAs.